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PDF] Chip scale package implementation challenges
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The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects. In the process of building the Consortium CSP test vehicles, many challenges were identified regarding various aspects of technology implementation. This paper will present our experience in the areas of technology implementation challenges, including design and building both standard and microvia boards, and assembly of two types of test vehicles. We also discuss the most current package isothermal aging to 2000 hours at 100/spl deg/C and 125/spl deg/C and thermal cycling test results to 1700 cycles in the range of -30 to 100/spl deg/C.
![https://media.springernature.com/lw685/springer-static/image/chp%3A10.1007%2F978-1-4939-1556-9_1/MediaObjects/306708_1_En_1_Fig8_HTML.gif](https://media.springernature.com/lw685/springer-static/image/chp%3A10.1007%2F978-1-4939-1556-9_1/MediaObjects/306708_1_En_1_Fig8_HTML.gif)
Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging
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Challenges and recent prospectives of 3D heterogeneous integration - ScienceDirect
![https://fastercapital.com/i/CHIPS-and-Blockchain--Exploring-the-Potential-Synergy--Challenges-and-Considerations-for-Implementing-CHIPS-and-Blockchain.webp](https://fastercapital.com/i/CHIPS-and-Blockchain--Exploring-the-Potential-Synergy--Challenges-and-Considerations-for-Implementing-CHIPS-and-Blockchain.webp)
Challenges and considerations in implementing - FasterCapital
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Package Substrate, SAMSUNG ELECTRO-MECHANICS
![https://www.mdpi.com/micromachines/micromachines-14-01149/article_deploy/html/images/micromachines-14-01149-g003-550.jpg](https://www.mdpi.com/micromachines/micromachines-14-01149/article_deploy/html/images/micromachines-14-01149-g003-550.jpg)
Micromachines, Free Full-Text
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Challenges Grow For Creating Smaller Bumps For Flip Chips
![https://d3i71xaburhd42.cloudfront.net/b27c39c73b32ecc54456a86627b2edf8156f645c/3-Table1-1.png](https://d3i71xaburhd42.cloudfront.net/b27c39c73b32ecc54456a86627b2edf8156f645c/3-Table1-1.png)
PDF] Chip scale package implementation challenges
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Femtosecond-precision electronic clock distribution in CMOS chips by injecting frequency comb-extracted photocurrent pulses
![https://www.mdpi.com/micromachines/micromachines-14-01149/article_deploy/html/images/micromachines-14-01149-g002-550.jpg](https://www.mdpi.com/micromachines/micromachines-14-01149/article_deploy/html/images/micromachines-14-01149-g002-550.jpg)
Micromachines, Free Full-Text
![https://semiengineering.com/wp-content/uploads/Picture1-2.png](https://semiengineering.com/wp-content/uploads/Picture1-2.png)
Chip Design Shifts As Fundamental Laws Run Out Of Steam
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Co-packaged optics (CPO): status, challenges, and solutions
![https://d3i71xaburhd42.cloudfront.net/b27c39c73b32ecc54456a86627b2edf8156f645c/8-Table3-1.png](https://d3i71xaburhd42.cloudfront.net/b27c39c73b32ecc54456a86627b2edf8156f645c/8-Table3-1.png)
PDF] Chip scale package implementation challenges
![https://spectrum.ieee.org/media-library/two-colorful-microscope-images.jpg?id=33603527&width=1200&height=600&coordinates=0%2C7%2C0%2C7](https://spectrum.ieee.org/media-library/two-colorful-microscope-images.jpg?id=33603527&width=1200&height=600&coordinates=0%2C7%2C0%2C7)
Photonic Chips Curb AI Training's Energy Appetite - IEEE Spectrum
![https://i0.wp.com/semiengineering.com/wp-content/uploads/Fig04_silent_data_error_screening.png?fit=1746%2C1038&ssl=1](https://i0.wp.com/semiengineering.com/wp-content/uploads/Fig04_silent_data_error_screening.png?fit=1746%2C1038&ssl=1)
Screening For Silent Data Errors
![https://www.mdpi.com/micromachines/micromachines-14-01149/article_deploy/html/images/micromachines-14-01149-g017-550.jpg](https://www.mdpi.com/micromachines/micromachines-14-01149/article_deploy/html/images/micromachines-14-01149-g017-550.jpg)
Micromachines, Free Full-Text